Packaging students take home top honors in Amazing Race at international Pack Expo

9 Nov 2022


News, Dunn

For packaging students like University of Wisconsin-Stout’s Anna Kent, attending the recent four-day, international Pack Expo conference in Chicago was a chance to size up their careers.

“A lot of what we saw was new machinery, advanced processing systems and new and innovating packaging forms. It was an extremely valuable learning experience,” said Kent, a senior from Eau Claire who will graduate in May.

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